21 Mar Requirements for. Soldered Electrical and Electronic. Assemblies. IPC/EIA J-STD C. MARCH Supersedes Revision B October Find the most up-to-date version of EIA J-STD at Engineering IPC- – Generic Standard on Printed Board Design. Published by IPC on November. There is always one document that steals the show, in this case IPC/EIA J-STD- , Requirements for Soldered Electrical and Electronic Assemblies, but are.
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Through lecture and actual inspections of a sample PCB the student will demonstrate their proficiency in identifying acceptable and defective conditions according to the Standard.
An open book examination is also required. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The type of solder alloy used for application specialist training is optional, based on the needs of the company. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. IPC received hundreds of requests from opc worldwide to support this critical standard with a formal training program that recognizes individuals as qualified instructors and u-std-001 them with teaching materials.
Components include a variety of axial and radial leaded devices. Although these are largely the responsibility of the design activity, some requirements in J-STDDS space addendum are intended to provide default materials requirements, or to at least initiate a discussion between manufacturing and the design activity. J Training Tool and Equipment List. Module Three — Pin-Through-Hole Technology This module provides requirements for though-hole technology consisting of lecture, review, and instructor demonstrations.
Now, IPC has an industry developed and approved comprehensive, hands-on solder training and certification program based on J-STD that gives companies all the tools they need to increase employee skills and performance.
Test method choices, defect definitions, acceptance criteria and illustrations for both the supplier and user. Those interested in company-wide quality assurance initiatives have an IPC-sponsored program to support their commitment to continuous operations and product improvement.
Download the course synopsis schedule format. Students must demonstrate proficiency in preparing and soldering wires to the above terminal types eiaa pass the open j-str-001 exam. Students must prepare and solder through hole components to a printed circuit board. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder paste.
Test methods covered include edge dip, rotary dip, solder float, wave solder, and wetting balance. Module 1 consists of lecture, review, and an open and closed book written exam. This program is offered as a service to industry, therefore its adoption is not a precondition for any company to purchase the standard or opc that they build product to its requirements.
Adjust for any alignment issues on the Word doc. Application Specialists must be trained on the introductory section, and then should be trained on additional modules covering: While there are no formal entrance requirements, Certified IPC Ilc candidates must have excellent hand soldering skills and ideally, in training as well.
Test kits based on this artwork are recommended for Application Specialist soldering demonstrations. Translated training materials for this program are available. IPC J-STD Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications. Any company that uses J-STD or is considering its adoption can use the program to address the training requirement identified in the standard.
Includes flux containing materials and low residue fluxes for no clean processes.
This is a quality control standard and is not intended to relate directly to the materials performance in the manufacturing process. Note that completion of module 1 is the starting point and should be accompanied by one or more additional knowledge modules. Assembly process engineers, quality assurance supervisors, training managers and others responsible for the quality and reliability of soldered electronic assemblies are excellent candidates for eiaa program.
Verify the correct alignment on another blank sheet Print the verified version on the certificate.
Module Four — Surface Mount Technology This module provides requirements for surface mount technology consisting of lecture, review, and instructor demonstrations. All written exam grades for Modules completed will be averaged together.
Additional languages are continuously being added.
The Application Specialists training is “modularized,” meaning that training on the entire document is not required. This program is offered as a service to industry, therefore its adoption is u-std-001 a precondition for any company to purchase the standard or claim that they build product to its requirements.
The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. Students must demonstrate proficiency in the above and also pass the end open book exam. IPC received hundreds of requests from companies worldwide to support this critical standard with a formal training program that recognizes individuals as qualified instructors and provides them with teaching materials.
Certified IPC Trainers may teach the course at any location and set a training fee, if applicable.
The students will prepare and solder wires to turret, bifurcated, J-hook, pierced, and cup terminals. Students must also remove components from a PCB in a non-destructive manner. Edit your existing full training course PowerPoint files to include or replace the existing training slides as appropriate.
Program Benefits Those interested in company-wide quality assurance initiatives have an IPC-sponsored program to support their commitment to continuous operations and product improvement.
IPC J-STD Training and Certification | IPC
Module Five — Inspection Methodology This module provides requirements for inspection methodology and a basic introduction to process control issues. Printable support materials Artwork for soldering test boards. To use the files: Click on the link for the j-sfd-001 course.